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Introduction 1.SMBF ultra-thin package shape, can be used in miniaturized circuits;
2.SMBF package chip variety, can package GPP, DB, Schottky, FRED, TVS and other chips;
3.SMBF products use environmentally friendly materials, in line with RoHS standards;
4.SMBF products are widely used in high and low voltage rectifier circuit, high frequency inverter, DC power protection, charging pile, AC power system protection and other fields.
Features 1. The SMBF package has better heat dissipation performance: The flat-footed SMBF package has shorter heat dissipation path, lower thermal resistance, higher derating inflection point temperature, and better high-temperature performance than the bent-footed SMB package.
2.SMBF package body is thin, small size, can be applied to miniaturized and integrated circuits.
SPECIFICATION
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